Toshiba targets automotive ECUs with new MOSFET package

Toshiba Electronics Europe has launched five new automotive-qualified metal-oxide-semiconductor field-effect transistors (MOSFETs) in a new DFN2020B(WF) package featuring a wettable flank structure, targeting applications including DC-DC converters for electronic control units (ECUs) and load switches for LED headlamps. The package measures 2.0 mm x 2.0 mm x 0.6 mm, reducing mounting area by approximately 43% and package height by approximately 25% compared with Toshiba’s existing SOT-23F package.

The wettable flank structure improves solder joint visibility, enabling quality confirmation via automated optical inspection (AOI) equipment. Solder joint shear strength is approximately 23% higher than the SOT-23F package in mounting tests. Despite the smaller footprint, the XSM6K361NW variant achieves a maximum power dissipation of 1.84 W, approximately 1.5 times higher than the 1.2 W rating of the comparable SOT-23F product.

The range comprises four N-channel and one P-channel device. All five products comply with AEC-Q101, the automotive industry reliability test standard, with Production Part Approval Process (PPAP) support available under IATF 16949. Toshiba says it plans to expand the DFN2020B(WF) lineup and introduce two-in-one MOSFET products in the same package format for automotive applications.

Source: Toshiba