GlobalFoundries and Renesas expand chip partnership

GlobalFoundries and Renesas Electronics have announced an expanded multi-billion-dollar manufacturing partnership to strengthen semiconductor supply for automotive and industrial applications. Under the agreement, Renesas will gain broader access to GlobalFoundries technologies including FDX (FD-SOI), BCD, and feature-rich CMOS platforms for its system-on-chips, power devices, and microcontrollers.

Tape-outs under the expanded collaboration are expected to begin in mid-2026. Manufacturing will start in the US and extend to GlobalFoundries facilities in Germany and Singapore, as well as through its manufacturing partnership in China. The companies are also considering porting select GlobalFoundries process technologies into Renesas facilities in Japan.

In a statement, Tim Breen, Chief Executive of GlobalFoundries, said: “The automotive landscape is changing fast. Semiconductors are now the foundation of innovation, powering advanced driver assistance, battery management and secure connectivity. These systems demand performance and efficiency under extreme conditions, and GF’s differentiated platforms are built for that.”

Hidetoshi Shibata, Chief Executive of Renesas, added: “Access to a broader range of GF technologies gives us the flexibility and supply assurance our customers need. This expanded partnership enables a stable, long-term supply of semiconductors while ensuring the highest quality and reliability for our products.”

GlobalFoundries said it now manufactures semiconductors used by the top three automotive MCU suppliers globally.

Source: GlobalFoundries